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Home / Product / Soldering-desoldering-rework-products / Solder-stencils-templates / BGA0034-S
BGA0034-S

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be obtained from the product data sheet.

BGA0034-S

  • Part No: BGA0034-S
  • Manufacturer: Chip Quik Inc.
  • In Stock: 13129
  • Description: BGA-676 (1.0 MM PITCH, 26 X 26 G
  • Shipping Date: 2025/2/3
  • Datasheet: BGA0034-S Datasheet
  • Category:Solder-stencils-templates
  • Lead-Time:Contact Our sales representative Email:sales@keepboomingtech.com
Category
Solder-stencils-templates
Manufacturer
Chip Quik Inc.
Series
Proto-Advantage BGA
Package
Bulk
RoHS
RoHs
Type
BGA
Pitch
0.039" (1.00mm)
Material
Stainless Steel
Part Status
Active
Inner Dimension
1.024" L x 1.024" W (26.00mm x 26.00mm)
Outer Dimension
2.600" L x 1.800" W (66.04mm x 45.72mm)
Thermal Center Pad
-
Number of Positions
676
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DUAL ROW 1.27MM PITCH 22-PIN CON

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DR127P24-S

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DUAL ROW 1.27MM PITCH 24-PIN CON

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DR127P40-S

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DUAL ROW 1.27MM PITCH 40-PIN CON

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DR127P80-S

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DUAL ROW 1.27MM PITCH 80-PIN CON

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DR200P04-S

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DUAL ROW 2MM PITCH 4-PIN CONNECT

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DR200P06-S

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DUAL ROW 2MM PITCH 6-PIN CONNECT

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DR200P08-S

DR200P08-S

DUAL ROW 2MM PITCH 8-PIN CONNECT

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