Category |
Solder-stencils-templates |
Manufacturer |
Chip Quik Inc. |
Series |
Proto-Advantage IPC |
Package |
Bulk |
RoHS |
RoHs |
Type |
BGA |
Pitch |
0.039" (1.00mm) |
Material |
Stainless Steel |
Part Status |
Active |
Inner Dimension |
0.315" L x 0.236" W (8.00mm x 6.00mm) |
Outer Dimension |
1.300" L x 0.900" W (33.02mm x 22.86mm) |
Thermal Center Pad |
- |
Number of Positions |
24 |