Category |
Solder |
Manufacturer |
Micro-Measurements (Division of Vishay Precision Group) |
Series |
- |
Package |
Jar |
RoHS |
RoHs |
Form |
Jar, 1 oz (28g) |
Type |
Solder Paste |
Process |
Lead Free |
Diameter |
- |
Flux Type |
- |
Mesh Type |
- |
Shelf Life |
9 Months |
Wire Gauge |
- |
Composition |
Ag40Cu30Zn28Ni2 (40/30/28/2) |
Part Status |
Active |
Melting Point |
1220 ~ 1435°F (660 ~ 780°C) |
Shelf Life Start |
Date of Manufacture |
Storage/Refrigeration Temperature |
41°F ~ 77°F (5°C ~ 25°C) |