
Category |
Solder |
Manufacturer |
Chip Quik Inc. |
Series |
Smooth Flow™ |
Package |
Bulk |
RoHS |
RoHs |
Form |
Jar, 8.8 oz (250g) |
Type |
Solder Paste |
Process |
Lead Free |
Diameter |
- |
Flux Type |
No-Clean |
Mesh Type |
4 |
Shelf Life |
6 Months |
Wire Gauge |
- |
Composition |
Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Part Status |
Active |
Melting Point |
422 ~ 428°F (217 ~ 220°C) |
Shelf Life Start |
Date of Manufacture |
Storage/Refrigeration Temperature |
37°F ~ 46°F (3°C ~ 8°C) |