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Home / Product / Prototyping-fabrication-products / Adapter-Breakout-Boards / PA0170
PA0170

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be obtained from the product data sheet.

PA0170

  • Part No: PA0170
  • Manufacturer: Chip Quik Inc.
  • In Stock: 7145
  • Description: MINI SOIC-8 EXP PAD TO DIP-8 SMT
  • Shipping Date: 2024/12/24
  • Datasheet: PA0170 Datasheet
  • Category:Adapter-Breakout-Boards
  • Lead-Time:Contact Our sales representative Email:sales@keepboomingtech.com
Category
Adapter-Breakout-Boards
Manufacturer
Chip Quik Inc.
Series
Proto-Advantage
Package
Bulk
RoHS
RoHs
Pitch
0.026" (0.65mm)
Material
FR4 Epoxy Glass
Part Status
Active
Board Thickness
0.062" (1.57mm) 1/16"
Package Accepted
MiniSOIC EP
Proto Board Type
SMD to DIP
Size / Dimension
0.700" x 0.400" (17.78mm x 10.16mm)
Number of Positions
8
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