
Category |
Solder |
Manufacturer |
Chip Quik Inc. |
Series |
SMD2 |
Package |
Bulk |
RoHS |
RoHs |
Form |
Jar |
Type |
Solder Sphere |
Process |
Lead Free |
Diameter |
0.008" (0.20mm) |
Flux Type |
- |
Mesh Type |
- |
Shelf Life |
24 Months |
Wire Gauge |
- |
Composition |
Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Part Status |
Active |
Melting Point |
423 ~ 428°F (217 ~ 220°C) |
Shelf Life Start |
Date of Manufacture |
Storage/Refrigeration Temperature |
- |