
Category |
Solder |
Manufacturer |
Chip Quik Inc. |
Series |
- |
Package |
Bulk |
RoHS |
RoHs |
Form |
- |
Type |
Wire Solder |
Process |
Lead Free |
Diameter |
0.030" (0.76mm) |
Flux Type |
- |
Mesh Type |
- |
Shelf Life |
- |
Wire Gauge |
21 AWG, 22 SWG |
Composition |
Bi57Sn42Ag1 (57/42/1) |
Part Status |
Active |
Melting Point |
281°F (138°C) |
Shelf Life Start |
- |
Storage/Refrigeration Temperature |
- |