
Category |
Solder |
Manufacturer |
Chip Quik Inc. |
Series |
- |
Package |
Bulk |
RoHS |
RoHs |
Form |
Syringe, 1.23 oz (35g), 10cc |
Type |
Solder Paste |
Process |
Lead Free |
Diameter |
- |
Flux Type |
No-Clean |
Mesh Type |
4 |
Shelf Life |
12 Months |
Wire Gauge |
- |
Composition |
Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Part Status |
Active |
Melting Point |
423 ~ 428°F (217 ~ 220°C) |
Shelf Life Start |
Date of Manufacture |
Storage/Refrigeration Temperature |
68°F ~ 77°F (20°C ~ 25°C) |